Concepedia

J. Sitek

JS

Statistics

Publications

16

Citations

334

H-Index

11

Active since

2004

Affiliations

Łukasiewicz Research Network - Tele and Radio Research Institute(Current)

Institute of Metallurgy and Materials Science

Polish Academy of Sciences

Warsaw University of Technology

Tohoku University

J. Sitek is an author at Łukasiewicz Research Network - Tele and Radio Research Institute specializing in materials engineering, soldering, and metals.

ORCID

Publications per year

2004–2015

16

Publications

16

Pb-Free Solders: Part III. Wettability Testing of Sn-Ag-Cu-Bi Alloys with Sb Additions

Z. Moser, W. Gąsior, K. Bukat et al. · Journal of Phase Equilibria and Diffusion · 2007 · 40 citations

, , +12

Silver nanoparticles effect on the wettability of Sn‐Ag‐Cu solder pastes and solder joints microstructure on copper

K. Bukat, Marek Kościelski, J. Sitek et al. · Soldering and Surface Mount Technology · 2011 · 38 citations

, , +17

(Sn-Ag)eut+Cu soldering materials, part I: Wettability studies

W. Gąsior, Z. Moser, J. Pstruś et al. · Journal of Phase Equilibria and Diffusion · 2004 · 34 citations

, , +11

Thermophysical properties and wetting behavior on Cu of selected SAC alloys

Tomasz Gancarz, J. Pstruś, K. Bukat et al. · Soldering and Surface Mount Technology · 2012 · 34 citations

, , +17

Evaluation of the influence of Bi and Sb additions to Sn‐Ag‐Cu and Sn‐Zn alloys on their surface tension and wetting properties using analysis of variance – ANOVA

K. Bukat, J. Sitek, Ryszard Kisiel et al. · Soldering and Surface Mount Technology · 2008 · 25 citations

, , +17

1–5 of 16