M. Miyauchi

Bump heat sink technology - A novel assembly technology suitable for power HBTs

H. Sato, M. Miyauchi, K. Sakuno et al. · 2002 · 21 citations

Low-power Electronics, Novel Assembly Technology, Electrical Engineering +14

Electromigration-induced void growth in bamboo structures

T. Kawanoue, H. Kaneko, M. Hasunuma et al. · Journal of Applied Physics · 1993 · 18 citations

Aluminium Nitride, Engineering, Mechanics Of Materials +18

Improvement in the electromigration lifetime using hyper-textured aluminum formed on amorphous tantalum-aluminum underlayer

Hiroshi Toyoda, T. Kawanoue, M. Hasunuma et al. · 1994 · 18 citations

Hyper-textured Aluminum, Aluminium Nitride, Engineering +19

A 3.5 W HBT MMIC power amplifier module for mobile communications

K. Sakuno, Masataka Akagi, H. Sato et al. · 2002 · 17 citations

Electrical Engineering, Engineering, Radio Frequency +7

A tight-binding calculation of the magnetic properties of TPt (T identical to 3d transition element) ordered alloys with CuAu structure

Y. Ohta, M. Miyauchi, Masao Shimizu · Journal of Physics Condensed Matter · 1989 · 16 citations

Magnetic Properties, Engineering, Magnetic Resonance +19