Lesley A. Polka

Package Technology to Address the Memory Bandwidth Challenge for Terascale Computing

Lesley A. Polka · Intel Technology Journal · 2007 · 68 citations

Computing, Computer Engineering, Computer Science +14

High frequency modeling and characterization of pin and land grid array sockets

Dong‐Ho Han, V. Prokofiev, W. Leigh et al. · 2004 · 18 citations

Engineering, Computer Engineering, Electrical Engineering +17

Package-Level Interconnect Design for Optimum Electrical Performance

Lesley A. Polka, D.G. Figueroa · 2000 · 13 citations

Engineering, Computer Engineering, Electrical Engineering +17

High-frequency methods for multiple diffraction modeling: application and comparison

Lesley A. Polka, Constantine A. Balanis, Anastasis C. Polycarpou · Journal of Electromagnetic Waves and Applications · 1994 · 10 citations

Engineering, Electrical Engineering, Antennas +16