Trevor Michael Braun

Author

National Institute of Standards and Technology ORCID

Also Known As

Braun, Trevor M., T M Braun, T. Braun, T. M. Braun, T.M. Braun, Trevor Braun, Trevor M Braun, Trevor M. Braun, Trevor Michael Braun

Publications

793

Citations

H-Index

Concepts

All Affiliations

National Institute of Standards and Technology DuPont (United States)Material Measurement Laboratory University of Washington

About

Trevor Michael Braun is an author at National Institute of Standards and Technology specializing in engineering, electrochemistry, and materials science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	11	12	616
2	Applied Physics	6	6	115
3	Chemical Engineering	5	5	106
4	Chemistry	4	4	117
5	Computer Engineering	1	1	52

Trevor Michael Braun

Publications

742

Citations

H-Index

Page 1

	Year	Citations
Security and privacy challenges in smart cities Trevor Michael Braun, Benjamin C. M. Fung, Farkhund Iqbal, Sustainable Cities and Society Privacy ChallengesEngineeringSmart CityInformation SecuritySecurity	2018	331
The Emerging Role of Electrodeposition in Additive Manufacturing Trevor Michael Braun, Daniel T. Schwartz The Electrochemical Society Interface Materials ScienceElectrical EngineeringCommercial Electrodeposition SystemsEngineeringFlexible Electronics	2016	52
Effect of Chloride Concentration on Copper Deposition in Through Silicon Vias Trevor Michael Braun, D. Josell, Manoj Silva, Journal of The Electrochemical Society	2019	46
High-Aspect-Ratio Ag Nanowire Mat Electrodes for Electrochemical CO Production from CO<sub>2</sub> David Raciti, Trevor Michael Braun, Brian M. Tackett, ACS Catalysis Materials ScienceChemical EngineeringEngineeringEconomic Co2 ConversionElectrolyzer Cell	2021	42
Superconformal Film Growth: From Smoothing Surfaces to Interconnect Technology Thomas P. Moffat, Trevor Michael Braun, David Raciti, Accounts of Chemical Research	2023	40
Localized Electrodeposition and Patterning Using Bipolar Electrochemistry Trevor Michael Braun, Daniel T. Schwartz Journal of The Electrochemical Society Materials ScienceEngineeringSurface ElectrochemistryUsing Bipolar ElectrochemistrySurface Science	2015	37
Editors' Choice—Simulation of Copper Electrodeposition in Through-Hole Vias Trevor Michael Braun, D. Josell, Jimmy John, Journal of The Electrochemical Society Materials ScienceElectromigration TechniqueEngineeringElectrochemical Surface ScienceNanotechnology	2019	37
Superconformal Nickel Deposition in Through Silicon Vias: Experiment and Prediction Trevor Michael Braun, Seok‐Kwun Kim, H. J. Lee, Journal of The Electrochemical Society	2018	30
Simulating the Influence of Supporting Electrolyte Concentration on Copper Electrodeposition in Microvias Trevor Michael Braun, Jimmy John, N. Jayaraju, Journal of The Electrochemical Society EngineeringElectrode-electrolyte InterfaceElectrolyte ConcentrationChemistryElectrometallurgy	2022	24
Simulation of Copper Electrodeposition in Millimeter Size Through-Silicon Vias Trevor Michael Braun, D. Josell, Sadanand V. Deshpande, Journal of The Electrochemical Society EngineeringIntegrated CircuitsChemical DepositionInterconnect (Integrated Circuits)Nanoelectronics	2020	19

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