Fumikazu Ohira

A novel flip-chip interconnection technique using solder bumps for high-speed photoreceivers

K. Katsura, Tsuyoshi Hayashi, Fumikazu Ohira et al. · Journal of Lightwave Technology · 1990 · 53 citations

Optical Materials, Engineering, High-speed Photoreceivers +22

Fabrication of two-dimensional fiber arrays using microferrules

Kunio Koyabu, Fumikazu Ohira, Tuyosi Yamamoto · IEEE Transactions on Components Packaging and Manufacturing Technology Part C · 1998 · 20 citations

Materials Science, Photonics, Engineering +13

Micro alignment machine for optical coupling

Yukio Kikuya, Motohisa Hirano, Kunio Koyabu et al. · 2002 · 14 citations

Engineering, Microscopy, Optomechanical System +16

Ellipsometric Characterization of Si Surface Damage Induced by Sputter Etching

Fumikazu Ohira · Journal of The Electrochemical Society · 1983 · 12 citations

Optical Materials, Ellipsometric Measurement, Engineering +24

Alignment of optical axes by using electrostatic force

Yukio Kikuya, Motohisa Hirano, Kunio Koyabu et al. · Optics Letters · 1993 · 11 citations

Photonics, Flexible Fiber, New Alignment Method +13