Hong Yang Jing

Ag–graphene hybrid conductive ink for writing electronics

Lianyong Xu, Guang Yang, Hong Yang Jing et al. · Nanotechnology · 2014 · 117 citations

Natural Sciences, Materials Engineering, Materials Science +17

Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-Free Solder

Y. D. Han, Hong Yang Jing, Mui Ling Sharon Nai et al. · Journal of Electronic Materials · 2009 · 60 citations

Natural Sciences, Materials Engineering, Materials Science +14

Pressure-assisted low-temperature sintering for paper-based writing electronics

Lianyong Xu, Guang Yu Yang, Hong Yang Jing et al. · Nanotechnology · 2013 · 41 citations

Natural Sciences, Materials Engineering, Materials Science +12

Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes

Y. D. Han, Hong Yang Jing, Mui Ling Sharon Nai et al. · Journal of Materials Science Materials in Electronics · 2011 · 38 citations

Natural Sciences, Materials Engineering, Materials Science +14

Effect of welding on the corrosion behavior of X65/Inconel 625 in simulated solution

Lianyong Xu, Hong Yang Jing, Y. D. Han · Welding in the World · 2018 · 34 citations

Engineering, Materials Engineering, Materials Science +16