Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes - Concepedia

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Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes

37

Citations

48

References

2011

Year

Y. D. Han, Hong Yang Jing, Mui Ling Sharon Nai, Lianyong Xu, Cher Ming Tan, Jun Wei

Journal of Materials Science Materials in Electronics

Materials ScienceEngineeringNanomaterialsMechanical EngineeringCreep Mitigation

References

	Year	Citations

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