Fang‐Lin Chao - Concepedia

Author

Fang‐Lin Chao

Industrial Technology Research Institute ORCID

Also Known As

C. Fanglin, Chao Fang-Lin, Chao Fanglin, F L Chao, F. L. Chao, F.-L. Chao, Fang-Lin CHAO, Fang-Lin Chao, Fang-lin Chao, Fanglin CHAO

124

Publications

1.1K

Citations

H-Index

Concepts

All Affiliations

Industrial Technology Research Institute ITRI International University of California, Los Angeles Kaohsiung Medical University National Taiwan University

About

Fang‐Lin Chao is an author at Industrial Technology Research Institute specializing in engineering, electrical engineering, and microelectronics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	14	15	533
2	Electrical Engineering	12	12	367
3	Applied Physics	8	8	268
4	Computer Engineering	7	7	251
5	Chemical Engineering	1	1	56

Fang‐Lin Chao

Publications

585

Citations

H-Index

Page 1

	Year	Citations
Cooling performance of silicon-based thermoelectric device on high power LED Jen‐Hau Cheng, Chun-Kai Liu, Fang‐Lin Chao, EngineeringThermoelectricsThermal ConductivityRefrigerationThermal Analysis	2005	75
Laddering wave in serpentine delay line Ruey‐Beei Wu, Fang‐Lin Chao IEEE Transactions on Components Packaging and Manufacturing Technology Part B EngineeringWave GroupWave PropagationMicrowave TransmissionComputer Engineering	1995	64
The preparation and use of high surface area silicon carbide catalyst supports M. Albert Vannice, Fang‐Lin Chao, Robert M. Friedman Applied Catalysis Materials EngineeringMaterials ScienceChemical EngineeringCatalytic MaterialEngineering	1986	56
Thermal evaluation and analyses of 3D IC integration SiP with TSVs for network system applications Heng-Chieh Chien, John H. Lau, Fang‐Lin Chao, EngineeringComputer ArchitectureIc Integration SipNetwork System ApplicationsPhysical Design (Electronics)	2012	50
Flat spiral delay line design with minimum crosstalk penalty Ruey‐Beei Wu, Fang‐Lin Chao IEEE Transactions on Components Packaging and Manufacturing Technology Part B EngineeringNovel Routing SchemePlanar Delay LineMicrowave TransmissionCrosstalk Penalty	1996	46
Through-Silicon Hole Interposers for 3-D IC Integration John H. Lau, Ching-Kuan Lee, Chau‐Jie Zhan, IEEE Transactions on Components Packaging and Manufacturing Technology Top ChipThrough-silicon Hole InterposersElectrical EngineeringChip-scale PackageEngineering	2014	45
Characteristics of Germanium-on-Insulators Fabricated by Wafer Bonding and Hydrogen-Induced Layer Splitting Fang‐Lin Chao, Roland W. Scholz, Manfred Reiche, Japanese Journal of Applied Physics EngineeringSilicon On InsulatorHydrogen-induced Layer SplittingNanoelectronicsElectronic Packaging	2006	39
Thermal Performance of 3D IC Integration with Through-Silicon Via (TSV) Heng-Chieh Chien, John H. Lau, Fang‐Lin Chao, Journal of Microelectronics and Electronic Packaging EngineeringThermal ConductivityInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors)Nanoelectronics	2012	29
Germanium $\hbox{n}^{+}/\hbox{p}$ Diodes: A Dilemma Between Shallow Junction Formation and Reverse Leakage Current Control Fang‐Lin Chao, Jason C. S. Woo IEEE Transactions on Electron Devices SemiconductorsSemiconductor TechnologyElectrical EngineeringElectronic DevicesEngineering	2010	28
Direct liquid cooling For IGBT power module Chun-Kai Liu, Fang‐Lin Chao, Shu-Jung Yang, Electrical EngineeringEngineeringLiquid Metal CoolingEnergy EfficiencyIgbt Power Module	2014	20

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