Concepedia

Bo Peng

BP

Statistics

Publications

16

Citations

364

H-Index

12

Active since

2003

Affiliations

Huazhong University of Science and Technology(Current)

State Grid Corporation of China (China)

Hefei University of Technology

Chinese Academy of Sciences

Bo Peng is an author at Huazhong University of Science and Technology specializing in engineering, mechanical engineering, and materials science.

Top concepts

EngineeringMaterial ScienceMechanical EngineeringMicroelectronicsElectrical InsulationMechanicsSolid MechanicsElectronic PackagingElectrical EngineeringMechanics Of Materials

Publications per year

2003–2025

16

Publications

16

The capacitance loss mechanism of metallized film capacitor under pulsed discharge condition

Hua Li, Yaohong Chen, Fuchang Lin et al. · IEEE Transactions on Dielectrics and Electrical Insulation · 2011 · 52 citations

Engineering, Electric Field Distortion, Glow Discharge +18

Analysis of interfacial peeling in IC chip pick-up process

Bo Peng, YongAn Huang, Zhouping Yin et al. · Journal of Applied Physics · 2011 · 46 citations · Full text

Engineering, Mechanical Engineering, Key Factors +19

On vibration control with Stewart parallel mechanism

Ren Gexue, Lu Qiuhai, Ning Hu et al. · Mechatronics · 2003 · 39 citations

Engineering, Mechanical Engineering, Mechanical Systems +6

Competing Fracture Modeling of Thin Chip Pick-Up Process

Bo Peng, YongAn Huang, Zhouping Yin et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 38 citations

Engineering, Mechanical Engineering, Fracture Behavior +17

Performance Analysis of Floodlight and Ryu SDN Controllers under Mininet Simulator

Yanzhen Li, Xiaobo Guo, Xue Pang et al. · 2020 · 35 citations

Engineering, Network Operation, Networked Control +18

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