Livia Racz

Analysis of flow between a wafer and pad during CMP processes

Chris Rogers, Jonathan Coppeta, Livia Racz et al. · Journal of Electronic Materials · 1998 · 43 citations

Engineering, Manufacturing Engineering, Manufacturing Processes +11

Determination of Equilibrium Shapes and Optimal Volume of Solder Droplets in the Assembly of Surface Mounted Integrated Circuits.

Livia Racz, J. Szekely · ISIJ International · 1993 · 42 citations · Full text

Engineering, Electrical Engineering, Materials Science +14

Investigating Slurry Transport Beneath a Wafer during Chemical Mechanical Polishing Processes

Jonathan Coppeta, Chris Rogers, Livia Racz et al. · Journal of The Electrochemical Society · 2000 · 40 citations

Engineering, Chemical Engineering, Process Dynamics +12

A General Statement of the Problem and Description of a Proposed Method of Calculation for Some Meniscus Problems in Materials Processing.

Livia Racz, J. Szekely, Kenneth A. Brakke · ISIJ International · 1993 · 32 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Development of Mold Compounds With Ultralow Coefficient of Thermal Expansion and High Glass Transition Temperature for Fan-Out Wafer-Level Packaging

Vinicio Carias, Jeffrey Y. Thompson, Philip D. Myers et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2015 · 28 citations

Natural Sciences, Materials Engineering, Materials Science +16