Statistics
Publications
1
Citations
10
H-Index
1
Active since
2002
Affiliations
University of Colorado Boulder(Current)
D. Hellman is an author at University of Colorado Boulder specializing in wafer-to-wafer bonding, materials science, and thermo-mechanical stress.
Publications per year
2002–2002
1
1
Thermosonic flip-chip bonding for an 8×8 VCSEL array
T. McLaren, Sa Yoon Kang, Wenge Zhang et al. · 2002 · 10 citations
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