Statistics
Publications
8
Citations
182
H-Index
8
Active since
1989
Affiliations
Gyoungbum Kim is an author at Samsung (South Korea) specializing in microelectronics, engineering, and electrical engineering.
Publications per year
1989–2021
8
8
Advanced Fan-Out Package SI/PI/Thermal Performance Analysis of Novel RDL Packages
Se-Ho You, Seong-Hwan Jeon, Dan Oh et al. · 2018 · 61 citations
Cost Effective 2.3D Packaging Solution by using Fanout Panel Level RDL
Joonsung Kim, Jaehoon Choi, Sanguk Kim et al. · 2021 · 29 citations
Advanced RDL Interposer PKG Technology for Heterogeneous Integration
Jae-gwon Jang, Kyoung-Lim Suk, Seokhyun Lee et al. · 2020 · 16 citations
1–5 of 8