A.J. Panks

Electrothermal CAD of power devices and circuits with fully physical time-dependent compact thermal modeling of complex nonlinear 3-d systems

W. Batty, C.E. Christoffersen, A.J. Panks et al. · IEEE Transactions on Components and Packaging Technologies · 2001 · 100 citations

Engineering, Computational Engineering, Electrical Engineering +17

Electrothermal modeling and measurement for spatial power combining at millimeter wavelengths

W. Batty, A.J. Panks, R.G. Johnson et al. · IEEE Transactions on Microwave Theory and Techniques · 1999 · 30 citations

Engineering, Electrical Engineering, Heat Transfer +16

Thermal transients in microwave active devices and their influence on intermodulation distortion

S. David, W. Batty, A.J. Panks et al. · 2002 · 21 citations

Engineering, Electrical Engineering, Microelectronics +16

Electro‐thermal Modelling of Monolithic and HybridMicrowave and Millimeter Wave IC′s

W. Batty, A.J. Panks, R.G. Johnson et al. · VLSI design · 1999 · 18 citations · Full text

Engineering, Computational Engineering, Electrical Engineering +17

Fully physical coupled electro-thermal simulations and measurements of power FETs

R.G. Johnson, W. Batty, A.J. Panks et al. · 2002 · 10 citations

Engineering, Computer Engineering, Electrical Engineering +17