Ikuo Soga

Carbon nanotube bumps for LSI interconnect

Ikuo Soga, Daiyu Kondo, Yoshitaka Yamaguchi et al. · 2008 · 46 citations

Engineering, Interconnect (Integrated Circuits), Carbon-based Material +17

Fluidic Assembly of Thin GaAs Blocks on Si Substrates

Ikuo Soga, Yutaka Ohno, Shigeru Kishimoto et al. · Japanese Journal of Applied Physics · 2003 · 20 citations

Fluidic Assembly, Engineering, Silicon On Insulator +21

Si microchannel cooler integrated with high power amplifiers for base station of mobile communication systems

Yoshihiro Mizuno, Ikuo Soga, Shinichi Hirose et al. · 2011 · 19 citations

Advanced Packaging, Electrical Engineering, Hpa Chip +13

Direct integration of GaAs HEMTs on AlN ceramic substrates using fluidic self-assembly

Ikuo Soga, S. Hayashi, Y. Ohno et al. · Electronics Letters · 2005 · 14 citations

Wide-bandgap Semiconductor, Aluminium Nitride, Engineering +17

Thermal management for flip-chip high power amplifiers utilizing carbon nanotube bumps

Ikuo Soga, Daiyu Kondo, Yasuhiro Yamaguchi et al. · 2009 · 12 citations

Engineering, Power Electronics, Rf Semiconductor +16