C. Y. Wu

Statistics

Publications

Citations

H-Index

Active since

2010

Affiliations

United Microelectronics (Taiwan)(Current)

C. Y. Wu is an author at United Microelectronics (Taiwan) specializing in thermomechanical stress, electronic materials, and thermo-mechanical stress.

Publications per year

2010–2015

Publications

Thermal stresses and deformations of Cu pillar flip chip BGA package: Analyses and measurements

Jhe-yu Jhou, Μ. Y. Tsai, C. Y. Wu et al. · 2010 · 18 citations

Engineering, Materials Engineering, Materials Science +17

14 nm chip package interaction development with Cu pillar bump flip chip package

Po Chen Kuo, Cheng Hsiao Wang, Kai Kuang Ho et al. · 2015 · 13 citations

Engineering, Electrical Engineering, Materials Engineering +17

Cu pattern density impacts on 2.5D TSI warpage using experimental and FEM analysis

Chan-Lin Yeh, C. Y. Wu, Chin-Fu Lin et al. · 2014 · 10 citations

Engineering, Electrical Engineering, Manufacturing Engineering +15

1–3 of 3