Statistics
Publications
3
Citations
50
H-Index
3
Active since
1992
Affiliations
Motorola (United States)(Current)
G. Dody is an author at Motorola (United States) specializing in materials engineering, mechanical behavior of materials, and materials science.
Publications per year
1992–2002
3
3
Effect of solder reflow temperature profile on plastic package delamination
Yingzhuo Huang, Deborah Hagen, G. Dody et al. · 2002 · 19 citations
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