Concepedia

Seungjun Noh

SN

Statistics

Publications

12

Citations

342

H-Index

11

Active since

2017

Affiliations

The University of Osaka(Current)

Osaka Research Institute of Industrial Science and Technology

Hyundai Mobis (South Korea)

Korea Institute of Industrial Technology

Seungjun Noh is an author at The University of Osaka specializing in engineering, materials science, and materials engineering.

Top concepts

EngineeringMaterial ScienceMaterials EngineeringApplied PhysicsElectronic PackagingElectrical EngineeringMechanical EngineeringMicrostructureThermal EngineeringHeat Transfer

Publications per year

2017–2023

12

Publications

12

Bonding technology based on solid porous Ag for large area chips

Chuantong Chen, Seungjun Noh, Hao Zhang et al. · Scripta Materialia · 2017 · 70 citations

Materials Engineering, Materials Science, Electrical Engineering +13

Enhanced cytomegalovirus infection in human trabecular meshwork cells and its implication in glaucoma pathogenesis

Jin A Choi, Ju-Eun Kim, Seungjun Noh et al. · Scientific Reports · 2017 · 55 citations · Full text

Thermal Shock Performance of DBA/AMB Substrates Plated by Ni and Ni–P Layers for High-Temperature Applications of Power Device Modules

Chanyang Choe, Chuantong Chen, Seungjun Noh et al. · Materials · 2018 · 43 citations · Full text

Development of high-strength and superior thermal shock-resistant GaN/DBA die attach structure with Ag sinter joining by thick Ni metallization

D. Kim, Chuantong Chen, Seungjun Noh et al. · Microelectronics Reliability · 2019 · 27 citations

Materials Science, Materials Engineering, Electrical Engineering +10

Improvement of the Bond Strength of Ag Sinter-Joining on Electroless Ni/Au Plated Substrate by a One-Step Preheating Treatment

Chuantong Chen, Zheng Zhang, Chanyang Choe et al. · Journal of Electronic Materials · 2018 · 24 citations

Materials Engineering, Materials Science, Electrical Engineering +6

1–5 of 12