Xingdong Sun

Investigation on the Material Removal and Surface Generation of a Single Crystal SiC Wafer by Ultrasonic Chemical Mechanical Polishing Combined with Ultrasonic Lapping

Yong Hu, Dong Shi, Ye Hu et al. · Materials · 2018 · 53 citations · Full text

Engineering, Mechanical Engineering, Ultrasonic Cmp +19

Effects of Temperature and Strain Rate on the Fracture Behaviors of an Al-Zn-Mg-Cu Alloy

Yue Guo, Mingxing Zhou, Xingdong Sun et al. · Materials · 2018 · 17 citations · Full text

Nanoindentation response of monocrystalline copper under various tensile pre-deformations via molecular dynamic simulations

Lijia Li, Xingdong Sun, Yue Guo et al. · Advances in Mechanical Engineering · 2018 · 11 citations · Full text

Influences of organic component on mechanical property of cortical bone with different water content by nanoindentation

Xingdong Sun, Li-Jia Li, Yue Guo et al. · AIP Advances · 2018 · 10 citations · Full text

Tissue Engineering, Demineralization Bone, Engineering +17

Type-II GaSe/MoS2 van der Waals Heterojunction for High-Performance Flexible Photodetector

Shuai Wang, Xiaoqiu Tang, Ezimetjan Alim et al. · Crystals · 2023 · 10 citations · Full text