Ye Hu

Investigation on the Material Removal and Surface Generation of a Single Crystal SiC Wafer by Ultrasonic Chemical Mechanical Polishing Combined with Ultrasonic Lapping

Yong Hu, Dong Shi, Ye Hu et al. · Materials · 2018 · 53 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Experimental investigation on the ultrasonically assisted single-sided lapping of monocrystalline SiC substrate

Yong Hu, Dong Shi, Ye Hu et al. · Journal of Manufacturing Processes · 2019 · 31 citations

Engineering, Materials Engineering, Materials Science +11

Microstructure and mechanical properties of dissimilar friction stir welds in austenitic-duplex stainless steels

Wenyang Wang, Ye Hu, Meng Zhang et al. · Materials Science and Engineering A · 2020 · 29 citations

Natural Sciences, Materials Engineering, Materials Science +15

Heat transfer of multi-slot nozzles air jet impingement with different Reynolds number

Jinqi Zhu, Ruifeng Dou, Ye Hu et al. · Applied Thermal Engineering · 2020 · 26 citations

Engineering, Aerospace Engineering, Mechanical Engineering +16

Experimental investigation on the flow around a circular cylinder with upstream splitter plate

Xiao Zhou, Jinjun Wang, Ye Hu · Journal of Visualization · 2019 · 25 citations

Engineering, Civil Engineering, Aerodynamics +12