Concepedia

Scott Popelar

SP

4

Publications

148

Citations

4

H-Index

1998

Active since

Affiliations

University of Colorado Colorado Springs(Current)

Scott Popelar is an author at University of Colorado Colorado Springs specializing in engineering, electronic packaging, and microelectronics.

Top concepts

EngineeringMaterial ScienceMicroelectronicsElectronic PackagingMicrostructureApplied PhysicsSolid MechanicsMechanical EngineeringMechanics Of MaterialsReliability

Publications per year

1998–2002

4

Publications

4

Interconnecting to aluminum- and copper-based semiconductors (electroless-nickel/gold for solder bumping and wire bonding)

Andrew Strandjord, Scott Popelar, Christine Jauernig · Microelectronics Reliability · 2002 · 61 citations

Materials Science, Aluminium Nitride, Electrical Engineering +11

A parametric study of flip chip reliability based on solder fatigue modelling

Scott Popelar · 2002 · 48 citations

Engineering, Mechanical Engineering, Parametric Study +21

An investigation into the fracture of silicon die used in flip chip applications

Scott Popelar · 2002 · 27 citations

Engineering, Mechanical Engineering, Advanced Packaging (Semiconductors) +19

A Parametric Study of Flip Chip Reliability Based on Solder Fatigue Modelling: Part II - Flip Chip on Organic

Scott Popelar · 1998 · 12 citations

Rows per page

1–4 of 4