Jim Blanche

Thermo-mechanical reliability tradeoffs for deployment of area array packages in harsh environments

Pradeep Lall, Naveen K. Singh, Jeffrey C. Suhling et al. · IEEE Transactions on Components and Packaging Technologies · 2005 · 25 citations

Engineering, Materials Engineering, Systems Engineering +17

Modeling and reliability characterization of area-array electronics subjected to high-g mechanical shock up to 50,000g

Pradeep Lall, Kewal Patel, Ryan Lowe et al. · 2012 · 20 citations

Engineering, Aerospace Engineering, Electrical Engineering +14

Thermal reliability considerations for Deployment of area array packages in harsh environments

Pradeep Lall, Naveen K. Singh, Jeffrey C. Suhling et al. · 2004 · 15 citations

Engineering, Design, Systems Engineering +17

Decision-Support Models for Thermo-Mechanical Reliability of Leadfree Flip-Chip Electronics in Extreme Environments

Pradeep Lall, Naveen K. Singh, Mark Strickland et al. · 2005 · 14 citations

Engineering, Computer Engineering, Design Automation +16

Microcoil Spring Interconnects for Ceramic Grid Array Integrated Circuits

S. M. Strickland, J. D. Hester, A. K. Gowan et al. · NASA STI Repository (National Aeronautics and Space Administration) · 2011 · 10 citations · Full text

Engineering, Aerospace Engineering, Electrical Engineering +13