Fangming Ye

TSV open defects in 3D integrated circuits

Fangming Ye, Krishnendu Chakrabarty · 2012 · 105 citations

Engineering, Vlsi Design, Tsv Open Defects +16

Board-Level Functional Fault Diagnosis Using Artificial Neural Networks, Support-Vector Machines, and Weighted-Majority Voting

Fangming Ye, Zhaobo Zhang, Krishnendu Chakrabarty et al. · IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems · 2013 · 101 citations

Fault Diagnosis, Engineering, Machine Learning +18

TSV defects and TSV-induced circuit failures: The third dimension in test and design-for-test

Krishnendu Chakrabarty, Sergej Deutsch, Himanshu Thapliyal et al. · 2012 · 68 citations

Engineering, Integrated Circuits, Tsv-induced Circuit Failures +21

Board-Level Functional Fault Diagnosis Using Multikernel Support Vector Machines and Incremental Learning

Fangming Ye, Zhaobo Zhang, Krishnendu Chakrabarty et al. · IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems · 2014 · 64 citations

Fault Diagnosis, Incremental Learning, Engineering +21

On effective and efficient in-field TSV repair for stacked 3D ICs

Li Jiang, Fangming Ye, Qiang Xu et al. · 2013 · 41 citations

3D Ic Architecture, Electrical Engineering, Engineering +13