Minki Cho

Pre-Bond and Post-Bond Test and Signal Recovery Structure to Characterize and Repair TSV Defect Induced Signal Degradation in 3-D System

Minki Cho, Chang Liu, Dae Hyun Kim et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 59 citations

Signal Recovery Structure, Electrical Engineering, 3D Ic Architecture +15

Design method and test structure to characterize and repair TSV defect induced signal degradation in 3D system

Minki Cho, Chang Liu, Dae Hyun Kim et al. · 2010 · 56 citations

3D Ic Architecture, Electrical Engineering, Reliability Engineering +15

Design method and test structure to characterize and repair TSV defect induced signal degradation in 3D system

Minki Cho, Chang Liu, Dae Hyun Kim et al. · International Conference on Computer Aided Design · 2010 · 53 citations

3D Ic Architecture, Electrical Engineering, Reliability Engineering +15

Postsilicon Voltage Guard-Band Reduction in a 22 nm Graphics Execution Core Using Adaptive Voltage Scaling and Dynamic Power Gating

Minki Cho, Stephen T. Kim, Carlos Tokunaga et al. · IEEE Journal of Solid-State Circuits · 2016 · 48 citations

Engineering, Vlsi Design, Energy Efficiency +17

Reconfigurable SRAM Architecture With Spatial Voltage Scaling for Low Power Mobile Multimedia Applications

Minki Cho, Jason Schlessman, Wayne Wolf et al. · IEEE Transactions on Very Large Scale Integration (VLSI) Systems · 2009 · 42 citations

Low-power Electronics, Electrical Engineering, Memory Architecture +13