Chae Yeon Lee is an author at Chung-Ang University specializing in engineering, reinforced concrete, and civil engineering.
Publications per year
2003–2025
2
2
3D Integrated Process and Hybrid Bonding of High Bandwidth Memory (HBM)
Chae Yeon Lee, C. Won, Seyeon Jung et al. · Electronic Materials Letters · 2025 · 13 citations
Rows per page
1–2 of 2