Concepedia

Publication | Closed Access

3D Integrated Process and Hybrid Bonding of High Bandwidth Memory (HBM)

DOI

13

Citations

101

References

2025

Year

Chae Yeon Lee, C. Won, Seyeon Jung, Eun Su Jung, Tae Min Choi, Hwa Rim Lee, JinUk Yoo, Songhun Yoon, Sung Gyu Pyo
Electronic Materials Letters

References

YearCitations

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