Concepedia

P.A. Magill

PM

Statistics

Publications

3

Citations

42

H-Index

3

Active since

1993

Affiliations

MCNC Research and Development Institute(Current)

P.A. Magill is an author at MCNC Research and Development Institute specializing in chip packaging, computer engineering, and electrical engineering.

Publications per year

1993–2002

3

Publications

3

Creep deformation of 96.5Sn-3.5Ag solder joints in a flip chip package

Hong Yang, P. Deane, P.A. Magill et al. · 2002 · 21 citations

, , +17

<title>Prototype optically interconnected multichip module based on computer-generated hologram technology</title>

James E. Morris, Michael R. Feldman, W. Hudson Welch et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 1993 · 11 citations

, , +17

Flip chip overview

P.A. Magill, P. Deane, J.D. Mis et al. · 2002 · 10 citations

, , +15

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