Statistics
Publications
3
Citations
43
H-Index
3
Active since
2002
Affiliations
P. Deane is an author at MCNC Research and Development Institute specializing in chip packaging, electronic materials, and microfabrication.
Publications per year
2002–2002
3
3
Creep deformation of 96.5Sn-3.5Ag solder joints in a flip chip package
Hong Yang, P. Deane, P.A. Magill et al. · 2002 · 21 citations
Natural Sciences, Materials Engineering, Materials Science +17
Issues with fine pitch bumping and assembly
S. Nangalia, P. Deane, S. Bonfede et al. · 2002 · 12 citations
P.A. Magill, P. Deane, J.D. Mis et al. · 2002 · 10 citations
Engineering, Computer Engineering, Electrical Engineering +15
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