Tetsuya Akaiwa

Influence of bismuth on the solidification of Sn-0.7Cu-0.05Ni-xBi/Cu joints

S. Belyakov, Jingwei Xian, K. Sweatman et al. · Journal of Alloys and Compounds · 2017 · 48 citations

Materials Science, Materials Engineering, Inorganic Chemistry +8

Precipitation and coarsening of bismuth plates in Sn–Ag–Cu–Bi and Sn–Cu–Ni–Bi solder joints

S. Belyakov, Jingwei Xian, Guang Zeng et al. · Journal of Materials Science Materials in Electronics · 2018 · 39 citations · Full text

Materials Science, Materials Engineering, Room Temperature +13

Investigating the Effects of Rapid Precipitation of Bi in Sn on the Shear Strength of BGA Sn-Bi Alloys

Qichao Hao, Xin Fu Tan, Stuart D. McDonald et al. · Journal of Electronic Materials · 2023 · 15 citations

Effects of Bi in Sn-Cu based lead-free solder alloys and interconnects

Kazuhiro Nogita, Mohd Arif Anuar Mohd Salleh, Selena Smith et al. · 2017 · 14 citations

Sac Solder Balls, Engineering, Mechanical Engineering +18

Role of Bi, Sb and In in microstructure formation and properties of Sn-0.7Cu-0.05Ni-X BGA interconnections

S. Belyakov, T. Nishimura, Tetsuya Akaiwa et al. · 2019 · 10 citations

Superconducting Material, Engineering, Mechanical Engineering +21