Concepedia

Jiro Utsunomiya

JU

2

Publications

35

Citations

2

H-Index

1993

Active since

Affiliations

Oki Electric Industry (Japan)(Current)

Jiro Utsunomiya is an author at Oki Electric Industry (Japan) specializing in electronic packaging, mechanical engineering, and engineering.

Top concepts

EngineeringElectronic PackagingMechanical Engineering3D PrintingHeat TransferThermodynamicsSolid MechanicsMaterial ScienceMicroelectronicsThermal Modeling

Publications per year

1993–2008

2

Publications

2

Analysis of Solderless Press-Fit Interconnections During the Assembly Process

Hironori Tohmyoh, Kiichiro Yamanobe, Masumi SAKA et al. · Journal of Electronic Packaging · 2008 · 22 citations

Engineering, Mechanical Engineering, Advanced Packaging (Semiconductors) +16

Thermal design for high-speed high-density multichip module

T. Handa, S. Iida, Jiro Utsunomiya · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1993 · 13 citations

Engineering, Energy Efficiency, Mechanical Engineering +24

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