Ruiwen Liu

Embedded cooling method with configurability and replaceability for multi-chip electronic devices

Nan Zhang, Binbin Jiao, Yuxin Ye et al. · Energy Conversion and Management · 2021 · 122 citations

Electrical Engineering, Engineering, Advanced Packaging (Semiconductors) +14

Experimental investigations on the thermal superposition effect of multiple hotspots for embedded microfluidic cooling

Yuxin Ye, Binbin Jiao, Yanmei Kong et al. · Applied Thermal Engineering · 2021 · 72 citations

Heat Transfer Process, Engineering, Liquid Metal Cooling +10

Effect of remelting and annealing on the wear resistance of AlCoCrFeNiTi0.5 high entropy alloys

Dan Kong, Jing Guo, Ruiwen Liu et al. · Intermetallics · 2019 · 57 citations

Materials Science, Materials Engineering, Engineering +8

A combined solution of thermoelectric coolers and microchannels for multi-chip heat dissipation with precise temperature uniformity control

Bo Cong, Yanmei Kong, Yuxin Ye et al. · Applied Thermal Engineering · 2022 · 47 citations

Electrical Engineering, Engineering, Liquid Metal Cooling +13

Multi-resonant wideband energy harvester based on a folded asymmetric M-shaped cantilever

Meng Wu, Yi Ou, Haiyang Mao et al. · AIP Advances · 2015 · 41 citations · Full text

Proof Mass, Electrical Engineering, Energy Harvesting +12