Concepedia

B. Salam

BS

Statistics

Publications

18

Citations

1.1K

H-Index

14

Active since

2001

Affiliations

Singapore Institute of Manufacturing Technology(Current)

National University of Singapore

Suzhou Research Institute

Agency for Science, Technology and Research

University of Greenwich

B. Salam is an author at Singapore Institute of Manufacturing Technology specializing in engineering, materials science, and electronic packaging.

Top concepts

EngineeringMaterial ScienceApplied PhysicsElectronic PackagingMechanical EngineeringMicrostructureFlexible ElectronicsMaterials EngineeringCorrosionElectrical Engineering

Publications per year

2001–2022

18

Publications

18

Deep learning enabled smart mats as a scalable floor monitoring system

Qiongfeng Shi, Zixuan Zhang, Tianyiyi He et al. · Nature Communications · 2020 · 305 citations · Full text

Wearable AMC Backed Near-Endfire Antenna for On-Body Communications on Latex Substrate

Kush Agarwal, Yong‐Xin Guo, B. Salam · IEEE Transactions on Components Packaging and Manufacturing Technology · 2016 · 162 citations

Human Body, Near-endfire Antenna, Engineering +12

Artificial Intelligence of Things (AIoT) Enabled Floor Monitoring System for Smart Home Applications

Qiongfeng Shi, Zixuan Zhang, Yanqin Yang et al. · ACS Nano · 2021 · 162 citations

Artificial Intelligence, Smart Sensor, Sensor Application +22

Ultrathin and Flexible Screen-Printed Metasurfaces for EMI Shielding Applications

Lin Biao Wang, Kye Yak See, Jun Wu Zhang et al. · IEEE Transactions on Electromagnetic Compatibility · 2011 · 94 citations

Screen Printing, Engineering, Metasurfaces +18

Robust triboelectric information‐mat enhanced by multi‐modality deep learning for smart home

Yanqin Yang, Qiongfeng Shi, Zixuan Zhang et al. · InfoMat · 2022 · 79 citations · Full text

Smart Sensor, Engineering, Machine Learning +20

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