Paul M. Dentinger

Removal of SU-8 photoresist for thick film applications

Paul M. Dentinger, W. Miles Clift, S.H. Goods · Microelectronic Engineering · 2002 · 126 citations

Materials Science, Materials Engineering, Su-8 Photoresist +8

Dendrimer-Activated Surfaces for High Density and High Activity Protein Chip Applications

Srikant Pathak, Anup K. Singh, James R. McElhanon et al. · Langmuir · 2004 · 92 citations

High aspect ratio patterning with a proximity ultraviolet source

Paul M. Dentinger, Karen Lee Krafcik, Kelby L. Simison et al. · Microelectronic Engineering · 2002 · 61 citations

Photonics, Engineering, Optical Properties +3

<title>Photoresist film thickness for extreme ultraviolet lithography</title>

Paul M. Dentinger, Gregory F. Cardinale, Craig C. Henderson et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2000 · 27 citations

Optical Materials, Engineering, Electron-beam Lithography +18

Electrical breakdown across micron scale gaps in MEMS structures

Fabian W. Strong, Jack L. Skinner, Paul M. Dentinger et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2006 · 27 citations

Electrical Engineering, Engineering, High Voltage Engineering +13