A. Mertol - Concepedia

Author

A. Mertol

Technion – Israel Institute of Technology

Also Known As

A. Mertol, Atila Mertol

Publications

536

Citations

H-Index

Concepts

All Affiliations

Technion – Israel Institute of Technology University of California, Berkeley Lawrence Berkeley National Laboratory

About

A. Mertol is an author at Technion – Israel Institute of Technology specializing in engineering, thermal engineering, and heat transfer.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	12	14	462
2	Social Sciences	2	2	33
3	Architectural Engineering	1	1	10
4	Chemistry	1	1	86
5	Civil Engineering	1	1	10

A. Mertol

Publications

462

Citations

H-Index

Page 1

	Year	Citations
Detailed Loop Model (DLM) analysis of liquid solar thermosiphons with heat exchangers A. Mertol, Wayne Place, Tom Webster, Solar Energy EngineeringSolar PowerLoop ModelHeat ExchangerThermodynamics	1981	86
The Transient and Stability Behavior of a Natural Convection Loop R. Greif, Y. Zvirin, A. Mertol Journal of Heat Transfer Natural Convection LoopEngineeringToroidal ThermosyphonHeat Transfer ProcessMixed Convection	1979	79
Application of the Taguchi method on the robust design of molded 225 plastic ball grid array packages A. Mertol IEEE Transactions on Components Packaging and Manufacturing Technology Part B EngineeringSolder BallMechanical EngineeringAdvanced ManufacturingComputer-aided Design	1995	44
The transient, steady state and stability behavior of a thermosyphon with throughflow A. Mertol, R. Greif, Y. Zvirin International Journal of Heat and Mass Transfer EngineeringSteady StateThermoacoustic Heat EngineFluid MechanicsMechanical Engineering	1981	39
Two-Dimensional Study of Heat Transfer and Fluid Flow in a Natural Convection Loop A. Mertol, R. Greif, Y. Zvirin Journal of Heat Transfer Natural Convection LoopEngineeringHeat Transfer ProcessMixed ConvectionFluid Mechanics	1982	39
Application of the Taguchi method to chip scale package (CSP) design A. Mertol IEEE Transactions on Advanced Packaging EngineeringIndustrial EngineeringChip Scale PackageSolder BallMechanical Engineering	2000	37
Estimation of aluminum and gold bond wire fusing current and fusing time A. Mertol IEEE Transactions on Components Packaging and Manufacturing Technology Part B Wire DiameterElectrical EngineeringEngineeringCorrosionBond Wire Diameter	1995	27
The effect of variations in convection coefficients on thermal energy storage in buildings Part I - Interior partition walls Hashem Akbari, Diego Sámano, A. Mertol, Energy and Buildings Built EnvironmentBuildings PartEnergy RefurbishmentEngineeringEnergy Efficiency	1986	23
Optimization of high pin count cavity-up enhanced plastic ball grid array (EPBGA) packages for robust design A. Mertol IEEE Transactions on Components Packaging and Manufacturing Technology Part B EngineeringMechanical EngineeringInterconnect (Integrated Circuits)Die AttachAdvanced Packaging (Semiconductors)	1997	20
Optimization of Extruded Type External Heat Sink for Multichip Module A. Mertol Journal of Electronic Packaging EngineeringEnergy EfficiencyMultichip ModuleMechanical EngineeringPower Electronic Systems	1993	18

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