Concepedia

Shalabh Tandon

ST

2

Publications

54

Citations

2

H-Index

2004

Active since

Affiliations

Intel (United States)(Current)

Shalabh Tandon is an author at Intel (United States) specializing in fatigue, electronic packaging, and reliability.

Top concepts

Publications per year

2004–2022

2

Publications

2

Intel 4 CMOS Technology Featuring Advanced FinFET Transistors optimized for High Density and High-Performance Computing

B. Sell, Seungchan An, Jeffrey L. Armstrong et al. · 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) · 2022 · 40 citations

Understanding the effect of dwell time on fatigue life of packages using thermal shock and intrinsic material behavior

Shubhada Sahasrabudhe, Eric B. Monroe, Shalabh Tandon et al. · 2004 · 14 citations

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