Chia-Yu Fu - Concepedia

Author

Chia-Yu Fu

Also Known As

C. Fu, C.C. Fu, Chia-Yu Fu, Chiayu Fu, Wang, Y.

Publications

130

Citations

H-Index

Concepts

All Affiliations

Chia-Yu Fu is an author at Georgia Institute of Technology specializing in engineering, thermal engineering, and electronic packaging.

#	Concept	H-Index	Publications	Citations
1	Engineering	5	5	99
2	Materials Science	3	3	64
3	Education	1	1	15
4	Electrical Engineering	1	1	34
5	Kinesiology	1	1	15

Chia-Yu Fu

Publications

Citations

H-Index

Page 1

	Year	Citations
A Finite Element Procedure of a Cyclic Thermoviscoplasticity Model for Solder and Copper Interconnects Chia-Yu Fu, David L. McDowell, I. Charles Ume Journal of Electronic Packaging EngineeringMechanical EngineeringFinite Element ProcedureNumerical SimulationThermal Modeling	1998	34
Thermal stress and fatigue analysis of plated-through holes using an internal state variable constitutive model Chia-Yu Fu, I. Charles Ume, David L. McDowell Finite Elements in Analysis and Design Thermal StressEngineeringMechanical BehaviorFatigue AnalysisMechanical Engineering	1998	20
Characterizing the temperature dependence of electronic packaging-material properties Chia-Yu Fu, Charles Ume JOM Materials ScienceEngineeringTemperature DependenceThermodynamicsThermal Conduction	1995	18
Direct Measurement of Index Finger Mechanical Impedance at Low Force Chia-Yu Fu, Matthew J. Oliver Haptic FeedbackEngineeringMeasurementMechanical EngineeringWearable Technology	2005	15
Thermoplastic Finite Element Analysis of Unfilled Plated-Through Holes During Wave Soldering Chia-Yu Fu, David L. McDowell, I. Charles Ume Journal of Electronic Packaging Unfilled Plated-through HolesEngineeringMechanical EngineeringResidual StressStress Analyses	2001	12

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