Concepedia

Chia-Yu Fu

CF

5

Publications

99

Citations

5

H-Index

1995

Active since

Affiliations

Georgia Institute of Technology(Current)

Motorola (United States)

Chia-Yu Fu is an author at Georgia Institute of Technology specializing in engineering, thermal engineering, and electronic packaging.

Top concepts

EngineeringThermal EngineeringElectronic PackagingMechanical EngineeringHeat TransferSolid MechanicsMaterial ScienceMechanics Of MaterialsMicrostructureThermodynamics

Publications per year

1995–2005

5

Publications

5

A Finite Element Procedure of a Cyclic Thermoviscoplasticity Model for Solder and Copper Interconnects

Chia-Yu Fu, David L. McDowell, I. Charles Ume · Journal of Electronic Packaging · 1998 · 34 citations

Engineering, Mechanical Engineering, Finite Element Procedure +22

Thermal stress and fatigue analysis of plated-through holes using an internal state variable constitutive model

Chia-Yu Fu, I. Charles Ume, David L. McDowell · Finite Elements in Analysis and Design · 1998 · 20 citations

Thermal Stress, Engineering, Mechanical Behavior +12

Characterizing the temperature dependence of electronic packaging-material properties

Chia-Yu Fu, Charles Ume · JOM · 1995 · 18 citations

Materials Science, Engineering, Temperature Dependence +8

Direct Measurement of Index Finger Mechanical Impedance at Low Force

Chia-Yu Fu, Matthew J. Oliver · 2005 · 15 citations

Haptic Feedback, Engineering, Measurement +20

Thermoplastic Finite Element Analysis of Unfilled Plated-Through Holes During Wave Soldering

Chia-Yu Fu, David L. McDowell, I. Charles Ume · Journal of Electronic Packaging · 2001 · 12 citations

Unfilled Plated-through Holes, Engineering, Mechanical Engineering +21

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