Ranjit Pandher

Drop Shock Reliability of Lead-Free Alloys - Effect of Micro-Additives

Ranjit Pandher, Brian G. Lewis, Raghasudha Vangaveti et al. · 2007 · 101 citations

Materials Science, Materials Engineering, Engineering +15

Design envelopes and optical feature extraction techniques for survivability of SnAg leadfree packaging architectures under shock and vibration

Pradeep Lall, Deepti Iyengar, Sandeep Shantaram et al. · 2008 · 55 citations

Advanced Packaging, Materials Science, Chip-scale Package +15

Reliability of Pb-free solder alloys in demanding BGA and CSP applications

Ranjit Pandher, Robert Healey · 2008 · 44 citations

Materials Science, Materials Engineering, Electrical Engineering +14

Interrogation of system state for damage assessment in lead-free electronics subjected to thermo-mechanical loads

Pradeep Lall, Chandan Bhat, Madhura Hande et al. · 2008 · 43 citations

Engineering, Lead-free Electronics, Mechanical Engineering +20

Design Envelopes and Optical Feature Extraction Techniques for Survivability of SnAg Lead-free Packaging Architectures Under Shock and Vibration

Pradeep Lall, Deepti Iyengar, Sandeep Shantaram et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2009 · 33 citations

Advanced Packaging, Materials Science, Engineering +14