Paiting Liu

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Active since

2001

Affiliations

National University of Singapore(Current)

Institute of Materials Research and Engineering

Paiting Liu is an author at National University of Singapore specializing in materials engineering, materials science, and thermal properties of materials.

ORCID

Publications per year

2001–2024

Publications

Interface delamination in plastic IC packages induced by thermal loading and vapor pressure - a micromechanics model

Paiting Liu, Li Cheng, Yong‐Wei Zhang · IEEE Transactions on Advanced Packaging · 2003 · 26 citations

Natural Sciences, Materials Engineering, Materials Science +17

Thermal Interface Hydrogel Composites Mechanically Compliant with Curvy Skins and Rigid Electronic Modules

Donghwan Ji, Paiting Liu, Pilseon Im et al. · Advanced Functional Materials · 2024 · 24 citations

Engineering, Materials Engineering, Materials Science +17

Measuring interface parameters and toughness—a computational study

Paiting Liu, Li Cheng, Yong‐Wei Zhang · Acta Materialia · 2001 · 21 citations

Natural Sciences, Materials Engineering, Materials Science +14

A dual-domain 3<b> <i>ω</i> </b> method for measuring the in-plane thermal conductivity of high-conductive thin films

Paiting Liu, Yue Wen, Chun Fei Siah et al. · Applied Physics Letters · 2023 · 11 citations

Natural Sciences, Materials Engineering, Materials Science +17

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