Ronald Hon

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Active since

2005

Affiliations

Hong Kong University of Science and Technology(Current)

Ronald Hon is an author at Hong Kong University of Science and Technology specializing in electronic materials, chip packaging, and deep reactive ion etching.

Publications per year

2005–2006

Publications

3D stacked flip chip packaging with through silicon vias and copper plating or conductive adhesive filling

S. W. Ricky Lee, Ronald Hon, S.X.D. Zhang et al. · 2005 · 41 citations

Engineering, Materials Engineering, Materials Science +17

Multi-Stack Flip Chip 3D Packaging with Copper Plated Through-Silicon Vertical Interconnection

Ronald Hon, S. W. Ricky Lee, S.X. Zhang et al. · 2006 · 36 citations

Engineering, Materials Science, Electronic Materials +16

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