Concepedia

Jingkun Mao

JM

Statistics

Publications

3

Citations

87

H-Index

3

Active since

2003

Affiliations

Missouri University of Science and Technology(Current)

Jingkun Mao is an author at Missouri University of Science and Technology specializing in engineering, electrical engineering, and electronic packaging.

Top concepts

Publications per year

2003–2010

3

Publications

3

Improving electromagnetic compatibility performance of packages and SiP modules using a conformal shielding solution

Nozad Karim, Jingkun Mao, Jun Fan · 2010 · 48 citations

, , +14

Effects of open stubs associated with plated through-hole vias in backpanel designs

Shaowei Deng, Jingkun Mao, T.H. Hubing et al. · 2004 · 21 citations

, , +6

Estimating DC power bus noise

Jingkun Mao, Bruce Archambeault, James L. Drewniak et al. · IEEE International Symposium on Electromagnetic Compatibility · 2003 · 18 citations

, , +12

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