Kyungjune Son

Signal Integrity Design and Analysis of Differential High-Speed Serial Links in Silicon Interposer With Through-Silicon Via

Kyungjun Cho, Youngwoo Kim, Hyunsuk Lee et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 39 citations

Engineering, Computer Engineering, Electrical Engineering +17

Signal Integrity and Computing Performance Analysis of a Processing-In-Memory of High Bandwidth Memory (PIM-HBM) Scheme

Seongguk Kim, Subin Kim, Kyungjun Cho et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2021 · 37 citations

Engineering, Computer Engineering, Electrical Engineering +17

Measurement and Analysis of Through Glass Via Noise Coupling and Shielding Structures in a Glass Interposer

Gapyeol Park, Youngwoo Kim, Kyungjun Cho et al. · IEEE Transactions on Electromagnetic Compatibility · 2021 · 24 citations

Engineering, Electrical Engineering, Microwave Engineering +16

Processing-in-memory in High Bandwidth Memory (PIM-HBM) Architecture with Energy-efficient and Low Latency Channels for High Bandwidth System

Seongguk Kim, Subin Kim, Kyungjun Cho et al. · 2019 · 21 citations

Engineering, Computer Engineering, Electrical Engineering +17

Analysis of Repetitive Bending on Flexible Wireless Power Transfer (WPT) PCB Coils for Flexible Wearable Devices

Seungtaek Jeong, Tae‐Wook Kim, Seongsoo Lee et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2022 · 21 citations

Engineering, Electrical Engineering, Materials Science +13