Y. P. Wang is an author at Rice University specializing in electronic packaging, applied physics, and condensed matter physics.
Top concepts
3D PrintingEngineeringMicrostructureApplied PhysicsSurface ScienceMaterial ScienceMicrofabricationAdvanced PackagingElectronic PackagingMaterials Engineering
Publications per year
2017–2024
3
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1–3 of 3