In recent years, selective metallization on polymer surfaces has attracted considerable attention due to its excellent properties and wide applications. This paper reports that copper phosphate (Cu₃(PO₄)₂) or nickel phosphate (Ni₃(PO₄)₂) was selected as laser-active material to successfully fabricate metallic patterns on ordinary polymer substrates by laser direct activation and electroless plating. Scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS) were utilized to characterize the interaction mechanism between a nanosecond-pulsed laser (355 and 1064 nm wavelengths) and Cu₃(PO₄)₂ or Ni₃(PO₄)₂. It was found that after 355 or 1064 nm laser activation with appropriate parameters, Cu⁺ was generated from Cu₃(PO₄)₂, and NiO was generated from Ni₃(PO₄)₂. At the same time, Cu⁺ or NiO adsorbed on the porous sponge-like microstructure of modified polycarbonate (PC), respectively, and acted as catalytic active centers to realize selective copper deposition in the laser-activated zone. Furthermore, the obtained copper layers were confirmed to possess good selectivity, electrical conductivity, and high adhesion strength (the highest grade of 5B). Moreover, from comparisons of Cu₃(PO₄)₂ with Ni₃(PO₄)₂ and of 355 nm laser activation with 1064 nm laser activation, the 1064 nm laser activation of Cu₃(PO₄)₂ produced the most catalytic seeds (Cu⁺) and had the best catalytic effect.

Jiankun Nie

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