Concepedia

M. Yanase

MY

4

Publications

116

Citations

4

H-Index

2013

Active since

Affiliations

Daido University(Current)

Toyota Motor Corporation (Switzerland)

Toyota Central Research and Development Laboratories (Japan)

M. Yanase is an author at Daido University specializing in engineering, electronic packaging, and applied physics.

Top concepts

EngineeringElectronic PackagingHeat TransferApplied PhysicsMaterial ScienceThermal EngineeringElectrical EngineeringNanomaterialsNanotechnologyThermodynamics

Publications per year

2013–2016

4

Publications

4

Thermal characterizations of Cu nanoparticle joints for power semiconductor devices

Toshitaka Ishizaki, Toshikazu Satoh, A. Kuno et al. · Microelectronics Reliability · 2013 · 46 citations

Materials Science, Engineering, Nanomaterials +11

Reliability of Cu nanoparticle joint for high temperature power electronics

Toshitaka Ishizaki, A. Kuno, A. Tane et al. · Microelectronics Reliability · 2014 · 39 citations

Materials Science, Electrical Engineering, Engineering +9

Thermal simulation of joints with high thermal conductivities for power electronic devices

Toshitaka Ishizaki, M. Yanase, A. Kuno et al. · Microelectronics Reliability · 2015 · 19 citations

High Thermal Conductivities, Electrical Engineering, Engineering +13

Novel heatsink for power semiconductor module using high thermal conductivity graphite

Yuri Yamada, M. Yanase, Daiki Miura et al. · Microelectronics Reliability · 2016 · 12 citations

Materials Science, Electrical Engineering, Engineering +14

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