J.A. Bielen

Evaluation of Creep in RF MEMS Devices

Marcel van Gils, J.A. Bielen, Gavin McDonald · 2007 · 42 citations

Engineering, Electrical Engineering, Mechanical Engineering +17

Neuro-electronic interfacing with multielectrode arrays

Wim Rutten, J.P.A. Smit, T.A. Frieswijk et al. · IEEE Engineering in Medicine and Biology Magazine · 1999 · 39 citations

Engineering, Bioengineering, Biomedical Engineering +17

Operating limits for RF power amplifiers at high junction temperatures

Z. Radivojević, Klas Andersson, J.A. Bielen et al. · Microelectronics Reliability · 2004 · 36 citations

Engineering, Electrical Engineering, Materials Science +14

Prediction of high cycle fatigue in aluminum bond wires: A physics of failure approach combining experiments and multi-physics simulations

J.A. Bielen, J.-J. Gommans, F. Theunis · 2006 · 35 citations

Engineering, Electrical Engineering, Materials Engineering +16

The influence of Sn–Cu–Ni(Au) and Sn–Au intermetallic compounds on the solder joint reliability of flip chips on low temperature co-fired ceramic substrates

Nian Duan, Jörn W. Scheer, J.A. Bielen et al. · Microelectronics Reliability · 2003 · 34 citations

Engineering, Materials Engineering, Materials Science +14