Yongmei Gan

Cu Clip-Bonding Method With Optimized Source Inductance for Current Balancing in Multichip SiC MOSFET Power Module

Laili Wang, Tongyu Zhang, Fengtao Yang et al. · IEEE Transactions on Power Electronics · 2022 · 70 citations

Optimized Source Inductance, Current Balancing, Electrical Engineering +15

Design Methodology of Bidirectional Resonant <i>CLLC</i> Charger for Wide Voltage Range Based on Parameter Equivalent and Time Domain Model

Lie Zhao, Yunqing Pei, Laili Wang et al. · IEEE Transactions on Power Electronics · 2022 · 64 citations

Electrical Engineering, Wide Voltage Range, Engineering +8

An Accurate Datasheet-Based Full-Characteristics Analytical Model of GaN HEMTs for Deadtime Optimization

Zhiyuan Qi, Yunqing Pei, Laili Wang et al. · IEEE Transactions on Power Electronics · 2020 · 52 citations

Wide-bandgap Semiconductor, Electrical Engineering, Engineering +12

Direct Integration of Optimized Phase-Change Heat Spreaders Into SiC Power Module for Thermal Performance Improvements Under High Heat Flux

Wei Mu, Laili Wang, Binyu Wang et al. · IEEE Transactions on Power Electronics · 2021 · 44 citations

Advanced Packaging, Electrical Engineering, Engineering +15

A Time-Domain-Model-Based Digital Synchronous Rectification Algorithm for <i>CLLC</i> Resonant Converters Utilizing a Hybrid Modulation

Long Pei, Lixin Jia, Laili Wang et al. · IEEE Transactions on Power Electronics · 2021 · 41 citations