R.J. Strain

The Buried Channel Charge Coupled Device

R.H. Walden, R.H. Krambeck, R.J. Strain et al. · Bell System Technical Journal · 1972 · 114 citations

Semiconductors, Electrical Engineering, Electronic Devices +14

On the Formation of Surface States during Stress Aging of Thermal Si-SiO[sub 2] Interfaces

A. Goetzberger, Antonio López, R.J. Strain · Journal of The Electrochemical Society · 1973 · 102 citations

Engineering, Stress Aging, Silicon On Insulator +17

A Nonlinear Diffusion Analysis of Charge-Coupled-Device Transfer

R.J. Strain, N. L. Schryer · Bell System Technical Journal · 1971 · 75 citations

Device Modeling, Low-power Electronics, Electrical Engineering +13

Properties of an idealized traveling-wave charge-coupled device

R.J. Strain · IEEE Transactions on Electron Devices · 1972 · 32 citations

Low-power Electronics, Electrical Engineering, Engineering +11

Fabrication and Performance Considerations of Charge-Transfer Dynamic Shift Registers

C. N. Berglund, R.J. Strain · Bell System Technical Journal · 1972 · 24 citations

Engineering, Vlsi Design, Emerging Memory Technology +17