David Hui

Co-Packaged Photonics For High Performance Computing: Status, Challenges And Opportunities

Ravi Mahajan, Xiaoqian Li, Joshua B. Fryman et al. · Journal of Lightwave Technology · 2021 · 152 citations

Engineering, Electrical Engineering, High-performance Computing +17

1.6 Tbps Silicon Photonics Integrated Circuit and 800 Gbps Photonic Engine for Switch Co-Packaging Demonstration

Saeed Fathololoumi, David Hui, Jian Chen et al. · Journal of Lightwave Technology · 2020 · 145 citations

Engineering, Computer Engineering, Electrical Engineering +17

5.2 Distributed system of digitally controlled microregulators enabling per-core DVFS for the POWER8<sup>TM</sup> microprocessor

Zeynep Toprak-Deniz, Michael Sperling, John F. Bulzacchelli et al. · 2014 · 119 citations

Engineering, Computer Engineering, Computer Systems +17

Electrostatic discharge protection in silicon-on-insulator technology

Steven H. Voldman, David Hui, L. Warriner et al. · 2003 · 36 citations

Engineering, Electrical Engineering, Microelectronics +16

Electrostatic discharge (ESD) protection in silicon-on-insulator (SOI) CMOS technology with aluminum and copper interconnects in advanced microprocessor semiconductor chips

Steven H. Voldman, David Hui, L. Warriner et al. · 2003 · 26 citations

Engineering, Computer Engineering, Electrical Engineering +16