Tomasz Krzaczek

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Active since

2015

Affiliations

Łukasiewicz Research Network - Tele and Radio Research Institute(Current)

Tomasz Krzaczek is an author at Łukasiewicz Research Network - Tele and Radio Research Institute specializing in component assembly, solder pastes, and accelerated aging tests.

Publications per year

2015–2015

Publications

Influence of assembly parameters on lead-free solder joints reliability in Package-on-Package (PoP) technology

J. Sitek, W. Stęplewski, Kamil Janeczek et al. · Soldering and Surface Mount Technology · 2015 · 11 citations

Engineering, Materials Engineering, Materials Science +14

Materials and soldering challenges in lead-free Package-on-Package (PoP) technology

Marek Kościelski, J. Sitek, W. Stęplewski et al. · Soldering and Surface Mount Technology · 2015 · 10 citations

Engineering, Materials Engineering, Materials Science +13

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