Statistics
Publications
1
Citations
24
H-Index
1
Active since
2009
Affiliations
Nanyang Technological University(Current)
Pinjala is an author at Nanyang Technological University specializing in heat dissipation, heat transfer, and cooling.
Publications per year
2009–2009
1
1
3D packaging with through ilicon via (TSV) for electrical and fluidic interconnections
Navas Khan, H.Y. Yu, Tan Siow Pin et al. · 2009 · 24 citations
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