Concepedia

Troy Ruud

TR

Statistics

Publications

2

Citations

24

H-Index

2

Active since

2011

Affiliations

ON Semiconductor (United States)(Current)

Brigham Young University - Idaho

Troy Ruud is an author at ON Semiconductor (United States) specializing in microelectronics, materials engineering, and electronic packaging.

Top concepts

EngineeringApplied PhysicsMaterial ScienceMicroelectronicsCrystalline DefectsElectronic PackagingMaterials EngineeringMechanical EngineeringThin FilmsMicrostructure

Publications per year

2011–2013

2

Publications

2

Use of harsh wire bonding to evaluate various bond pad structures

Stevan Hunter, Bryce Rasmussen, Troy Ruud et al. · European Microelectronics and Packaging Conference · 2011 · 13 citations

Pad Robustness, Engineering, Mechanical Engineering +19

Use of Harsh Wafer Probing to Evaluate Traditional and CUP Bond Pad Structures

Stevan Hunter, José Hernández Martínez, Carlos Salas et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2013 · 11 citations

Engineering, Harsh Wafer, Mechanical Engineering +19

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